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  gbpc1005 thru gbpc110 vishay semiconductors formerly general semiconductor document number 88611 www.vishay.com 19-feb-02 1 glass passivated single-phase bridge rectifier rectifier reverse voltage 50 and 1000 v rectifier forward current 3.0 a hole for #6 screw 0.158 (4.01) 0.142 (3.61) dia. 0.128 (3.25) 0.048 (1.22) 0.200 (5.08) 0.160 (4.06) 0.750 (19.05) min. 0.040 (1.02) typ. 0.094 (2.4) x 45 degrees 0.445 (11.30) 0.405 (10.29) 0.630 (16.00) 0.590 (14.98) ac ac polarity shown on side of case: positive lead by beveled corner 0.445 (11.30) 0.405 (10.29) 0.630 (16.00) 0.590 (14.98) 0.032 (0.81) 0.028 (0.71) dia. maximum ratings & thermal characteristics ratings at 25? ambient temperature unless otherwise specified. gbpc gbpc gbpc gbpc gbpc gbpc gbpc sybmols 1005 101 102 104 106 108 110 units maximum repetitive peak reverse voltage v rrm 50 100 200 400 600 800 1000 v maximum rms bridge input voltage v rms 35 70 140 280 420 560 700 v maximum dc blocking voltage v dc 50 100 200 400 600 800 1000 v maximum average forward t c =60? (2) 3.0 rectified output current at t a =25? (3) i f(av) 2.0 a peak forward surge current single sine-wave superimposed on rated load i fsm 60 a (jedec method) t c =60? rating for fusing (t<8.3ms) i 2 t15a 2 sec typical thermal resistance per leg (note 1) r ja 12 r jc 8.0 ?/w operating junction and storage temperature range t j, t stg -55 to +150 ? electrical characteristics ratings at 25? ambient temperature unless otherwise specified. maximum instantaneous forward voltage drop per leg at 1.5 amperes v f 1.0 v maximum dc reverse current at rated t a = 25? 5.0 dc blocking voltage per leg t a =125? i r 500 a typical junction capacitance per leg at 4.0v, 1mhz c j 21 pf notes: (1) bolt down on heat-sink with silicone thermal compound between bridge and mounting surface for maximum heat transfer with #6 screw (2) unit mounted on 4.0 x 4.0 x 0.11" thick (10.5 x 10.5 x 0.3cm) al. plate (3) unit mounted on p.c.b. at 0.375" (9.5mm) lead length with 0.5 x 0.5" (12 x 12mm) copper pads dimensions in inches and (millimeters) features ?plastic package has underwriters laboratory flammability classification 94v-0 ?this series is ul listed under the recognized component index, file number e54214 ?glass passivated chip junction ?high case dielectric with standing voltage of 1500 v rms ?typical i r less than 0.1 a ?high surge current capability ?ideal for printed circuit boards ?high temperature soldering guaranteed: 260?/10 seconds, 0.375 (9.5mm) lead length, 5lbs. (2.3kg) tension mechanical data case: molded plastic body over passivated junctions terminals: plated leads solderable per mil-std-750, method 2026 mounting position: any (note 1) weight: 0.1 oz., 2.8 g packaging codes/options: 1/100 ea. per bulk box case style gbpc1
gbpc1005 thru gbpc110 vishay semiconductors formerly general semiconductor www.vishay.com document number 88611 2 19-feb-02 ratings and characteristic curves (t a = 25? unless otherwise noted) ambient temperature ( c) fig. 1 ? derating curve output rectified current average forward output current (a) fig. 3 ? typical forward characteristics per leg instantaneous forward voltage (v) instantaneous forward current (a) percent of rated peak reverse voltage (%) instantaneous reverse current ( a) fig. 4 ? typical reverse leakage characteristics per leg fig. 6 ? typical transient thermal impedance per leg number of cycles at 60 h z t, heating time (sec.) fig. 2 ? maximum non-repetitive peak forward surge current per leg peak forward surge current (a) reverse voltage (v) junction capacitance, pf transient thermal impedance ( c/w) fig. 5 ? typical junction capacitance per leg 0 50 100 150 0 1.0 2.0 3.0 4.0 5.0 case temperature, t c heatsink mounting 4.0 x 4.0 x 0.11" thk (10.5 x 10.5 x 0.3cm) al. plate 60 h z resistive or inductive load ambient temperature, t a p.c.b. mounting 0.375" (9.5mm) lead length 1 10 100 0 10 20 30 40 50 60 1.0 cycle t c = 60 c single sine-wave (jedec method) 0.4 0.6 0.8 1.0 1.2 1.4 1.6 0.01 0.1 1 10 20 t j = 25 c pulse width = 300 s 1% duty cycle 0 20 40 60 80 0.01 0.1 1 10 50 100 0.1 1.0 10 100 1 10 100 t j = 25 c f = 1.0mh z vsig = 50mvp-p 0.01 0.1 1 10 100 0.1 1 10 100 t j = 125 c t j = 25 c


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